3D Integrated Circuit Cooling with Microfluidics.

Wang S, Yin Y, Hu C, Rezai P

DOI: 10.3390/mi9060287
Published: 2018 Jun 7
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi9060287,
  title = {3D Integrated Circuit Cooling with Microfluidics.},
  author = {Wang S and Yin Y and Hu C and Rezai P},
  year = {2018},
  journal = {Micromachines},
  doi = {10.3390/mi9060287},
  url = {https://doi.org/10.3390/mi9060287}
}

RIS

TY  - JOUR
TI  - 3D Integrated Circuit Cooling with Microfluidics.
AU  - Wang S
AU  - Yin Y
AU  - Hu C
AU  - Rezai P
PY  - 2018
JO  - Micromachines
DO  - 10.3390/mi9060287
UR  - https://doi.org/10.3390/mi9060287
ER  -

APA

S, W., Y, Y., C, H., & P, R. (2018). 3D Integrated Circuit Cooling with Microfluidics.. Micromachines. https://doi.org/10.3390/mi9060287

Source records

pubmed · retrieved 2026-09-26T02:08:09.454Z