3D Integrated Circuit Cooling with Microfluidics

Shaoxi Wang, Yue Yin, Chenxia Hu, Pouya Rezai

Open source

DOI: 10.3390/mi9060287
Published: 2018-06-07
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi9060287,
  title = {3D Integrated Circuit Cooling with Microfluidics},
  author = {Shaoxi Wang and Yue Yin and Chenxia Hu and Pouya Rezai},
  year = {2018},
  journal = {Micromachines},
  doi = {10.3390/mi9060287},
  url = {https://doi.org/10.3390/mi9060287}
}

RIS

TY  - JOUR
TI  - 3D Integrated Circuit Cooling with Microfluidics
AU  - Shaoxi Wang
AU  - Yue Yin
AU  - Chenxia Hu
AU  - Pouya Rezai
PY  - 2018
JO  - Micromachines
DO  - 10.3390/mi9060287
UR  - https://doi.org/10.3390/mi9060287
ER  -

APA

Wang, S., Yin, Y., Hu, C., & Rezai, P. (2018). 3D Integrated Circuit Cooling with Microfluidics. Micromachines. https://doi.org/10.3390/mi9060287

Source records

crossref · retrieved 2026-11-10T13:25:46.598Z