Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study

Kunqi Cui, Yang Wang, Wenchao Yan, Teng Cao, Yan Du, Kai Wu, Li Guo

Open source

DOI
10.3390/molecules30142960
Published
2025-07-14
Container
Molecules
Publisher
MDPI AG
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.3390/molecules30142960,
  title = {Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study},
  author = {Kunqi Cui and Yang Wang and Wenchao Yan and Teng Cao and Yan Du and Kai Wu and Li Guo},
  year = {2025},
  journal = {Molecules},
  doi = {10.3390/molecules30142960},
  url = {https://doi.org/10.3390/molecules30142960}
}

RIS

TY  - JOUR
TI  - Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study
AU  - Kunqi Cui
AU  - Yang Wang
AU  - Wenchao Yan
AU  - Teng Cao
AU  - Yan Du
AU  - Kai Wu
AU  - Li Guo
PY  - 2025
JO  - Molecules
DO  - 10.3390/molecules30142960
UR  - https://doi.org/10.3390/molecules30142960
ER  - 

APA

Cui, K., Wang, Y., Yan, W., Cao, T., Du, Y., Wu, K., & Guo, L. (2025). Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study. Molecules. https://doi.org/10.3390/molecules30142960

Source records