Influence of Additive N(2) on O(2) Plasma Ashing Process in Inductively Coupled Plasma.
- DOI
- 10.3390/nano12213798
- Published
- 2022 Oct 27
- Container
- Nanomaterials (Basel, Switzerland)
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/nano12213798,
title = {Influence of Additive N(2) on O(2) Plasma Ashing Process in Inductively Coupled Plasma.},
author = {You YB and Lee YS and Kim SJ and Cho CH and Seong IH and Jeong WN and Choi MS and You SJ},
year = {2022},
journal = {Nanomaterials (Basel, Switzerland)},
doi = {10.3390/nano12213798},
url = {https://doi.org/10.3390/nano12213798}
}RIS
TY - JOUR TI - Influence of Additive N(2) on O(2) Plasma Ashing Process in Inductively Coupled Plasma. AU - You YB AU - Lee YS AU - Kim SJ AU - Cho CH AU - Seong IH AU - Jeong WN AU - Choi MS AU - You SJ PY - 2022 JO - Nanomaterials (Basel, Switzerland) DO - 10.3390/nano12213798 UR - https://doi.org/10.3390/nano12213798 ER -
APA
YB, Y., YS, L., SJ, K., CH, C., IH, S., WN, J., MS, C., & SJ, Y. (2022). Influence of Additive N(2) on O(2) Plasma Ashing Process in Inductively Coupled Plasma.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano12213798
Source records
- pubmed · retrieved 2026-11-10T11:22:38.276Z