A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten.

Doddapaneni VVK, Lee K, Aysal HE, Paul BK, Pasebani S, Sierros KA, Okwudire CE, Chang CH

DOI: 10.3390/nano13162303
Published: 2023 Aug 10
Container: Nanomaterials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/nano13162303,
  title = {A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten.},
  author = {Doddapaneni VVK and Lee K and Aysal HE and Paul BK and Pasebani S and Sierros KA and Okwudire CE and Chang CH},
  year = {2023},
  journal = {Nanomaterials (Basel, Switzerland)},
  doi = {10.3390/nano13162303},
  url = {https://doi.org/10.3390/nano13162303}
}

RIS

TY  - JOUR
TI  - A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten.
AU  - Doddapaneni VVK
AU  - Lee K
AU  - Aysal HE
AU  - Paul BK
AU  - Pasebani S
AU  - Sierros KA
AU  - Okwudire CE
AU  - Chang CH
PY  - 2023
JO  - Nanomaterials (Basel, Switzerland)
DO  - 10.3390/nano13162303
UR  - https://doi.org/10.3390/nano13162303
ER  -

APA

VVK, D., K, L., HE, A., BK, P., S, P., KA, S., CE, O., & CH, C. (2023). A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano13162303

Source records

pubmed · retrieved 2026-09-26T05:59:29.350Z