Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration.

Bao W, Zhang J, Wong H, Liu J, Li W

DOI: 10.3390/nano15100729
Published: 2025 May 12
Container: Nanomaterials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/nano15100729,
  title = {Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration.},
  author = {Bao W and Zhang J and Wong H and Liu J and Li W},
  year = {2025},
  journal = {Nanomaterials (Basel, Switzerland)},
  doi = {10.3390/nano15100729},
  url = {https://doi.org/10.3390/nano15100729}
}

RIS

TY  - JOUR
TI  - Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration.
AU  - Bao W
AU  - Zhang J
AU  - Wong H
AU  - Liu J
AU  - Li W
PY  - 2025
JO  - Nanomaterials (Basel, Switzerland)
DO  - 10.3390/nano15100729
UR  - https://doi.org/10.3390/nano15100729
ER  -

APA

W, B., J, Z., H, W., J, L., & W, L. (2025). Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano15100729

Source records

pubmed · retrieved 2026-09-26T15:46:32.426Z
europe-pmc · retrieved 2026-09-26T15:46:32.430Z