Bridging Additive Manufacturing and Electronics Printing in the Age of AI.

Chen J, Yuan Y, Wang Q, Wang H, Advincula RC

Open source

DOI: 10.3390/nano15110843
Published: 2025 May 31
Container: Nanomaterials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/nano15110843,
  title = {Bridging Additive Manufacturing and Electronics Printing in the Age of AI.},
  author = {Chen J and Yuan Y and Wang Q and Wang H and Advincula RC},
  year = {2025},
  journal = {Nanomaterials (Basel, Switzerland)},
  doi = {10.3390/nano15110843},
  url = {https://doi.org/10.3390/nano15110843}
}

RIS

TY  - JOUR
TI  - Bridging Additive Manufacturing and Electronics Printing in the Age of AI.
AU  - Chen J
AU  - Yuan Y
AU  - Wang Q
AU  - Wang H
AU  - Advincula RC
PY  - 2025
JO  - Nanomaterials (Basel, Switzerland)
DO  - 10.3390/nano15110843
UR  - https://doi.org/10.3390/nano15110843
ER  -

APA

J, C., Y, Y., Q, W., H, W., & RC, A. (2025). Bridging Additive Manufacturing and Electronics Printing in the Age of AI.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano15110843

Source records

pubmed · retrieved 2026-09-25T04:33:15.245Z
europe-pmc · retrieved 2026-09-25T04:33:15.274Z
doaj · retrieved 2026-09-25T04:33:15.245Z