Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.

Silva V, Colmiais I, Dinis H, Borme J, Alpuim P, Mendes PM

Open source

DOI
10.3390/nano15141119
Published
2025 Jul 18
Container
Nanomaterials (Basel, Switzerland)
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.3390/nano15141119,
  title = {Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.},
  author = {Silva V and Colmiais I and Dinis H and Borme J and Alpuim P and Mendes PM},
  year = {2025},
  journal = {Nanomaterials (Basel, Switzerland)},
  doi = {10.3390/nano15141119},
  url = {https://doi.org/10.3390/nano15141119}
}

RIS

TY  - JOUR
TI  - Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.
AU  - Silva V
AU  - Colmiais I
AU  - Dinis H
AU  - Borme J
AU  - Alpuim P
AU  - Mendes PM
PY  - 2025
JO  - Nanomaterials (Basel, Switzerland)
DO  - 10.3390/nano15141119
UR  - https://doi.org/10.3390/nano15141119
ER  - 

APA

V, S., I, C., H, D., J, B., P, A., & PM, M. (2025). Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano15141119

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