Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.
- DOI
- 10.3390/nano15141119
- Published
- 2025 Jul 18
- Container
- Nanomaterials (Basel, Switzerland)
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/nano15141119,
title = {Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.},
author = {Silva V and Colmiais I and Dinis H and Borme J and Alpuim P and Mendes PM},
year = {2025},
journal = {Nanomaterials (Basel, Switzerland)},
doi = {10.3390/nano15141119},
url = {https://doi.org/10.3390/nano15141119}
}RIS
TY - JOUR TI - Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. AU - Silva V AU - Colmiais I AU - Dinis H AU - Borme J AU - Alpuim P AU - Mendes PM PY - 2025 JO - Nanomaterials (Basel, Switzerland) DO - 10.3390/nano15141119 UR - https://doi.org/10.3390/nano15141119 ER -
APA
V, S., I, C., H, D., J, B., P, A., & PM, M. (2025). Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration.. Nanomaterials (Basel, Switzerland). https://doi.org/10.3390/nano15141119