Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges

Yinjie Shen, Jia Fu, Fengguo Han, Dongbo Li, Bing Yang, Yunqing Tang

Open source

DOI: 10.3390/nano15161236
Published: 2025-08-13
Container: Nanomaterials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/nano15161236,
  title = {Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges},
  author = {Yinjie Shen and Jia Fu and Fengguo Han and Dongbo Li and Bing Yang and Yunqing Tang},
  year = {2025},
  journal = {Nanomaterials},
  doi = {10.3390/nano15161236},
  url = {https://doi.org/10.3390/nano15161236}
}

RIS

TY  - JOUR
TI  - Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges
AU  - Yinjie Shen
AU  - Jia Fu
AU  - Fengguo Han
AU  - Dongbo Li
AU  - Bing Yang
AU  - Yunqing Tang
PY  - 2025
JO  - Nanomaterials
DO  - 10.3390/nano15161236
UR  - https://doi.org/10.3390/nano15161236
ER  -

APA

Shen, Y., Fu, J., Han, F., Li, D., Yang, B., & Tang, Y. (2025). Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges. Nanomaterials. https://doi.org/10.3390/nano15161236

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crossref · retrieved 2026-09-25T15:11:01.269Z