Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO(2), and Silicon-EMC) Found in Microchips.
- DOI
- 10.3390/polym17040520
- Published
- 2025 Feb 17
- Container
- Polymers
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/polym17040520,
title = {Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO(2), and Silicon-EMC) Found in Microchips.},
author = {Videira PFC and Ferreira RA and Maleki P and Akhavan-Safar A and Carbas RJC and Marques EAS and Karunamurthy B and da Silva LFM},
year = {2025},
journal = {Polymers},
doi = {10.3390/polym17040520},
url = {https://doi.org/10.3390/polym17040520}
}RIS
TY - JOUR TI - Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO(2), and Silicon-EMC) Found in Microchips. AU - Videira PFC AU - Ferreira RA AU - Maleki P AU - Akhavan-Safar A AU - Carbas RJC AU - Marques EAS AU - Karunamurthy B AU - da Silva LFM PY - 2025 JO - Polymers DO - 10.3390/polym17040520 UR - https://doi.org/10.3390/polym17040520 ER -
APA
PFC, V., RA, F., P, M., A, A., RJC, C., EAS, M., B, K., & LFM, D. S. (2025). Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO(2), and Silicon-EMC) Found in Microchips.. Polymers. https://doi.org/10.3390/polym17040520
Source records
- pubmed · retrieved 2026-11-10T11:27:38.654Z