Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions.

Sun Y, Wang H, Jiang J, Wang K, Bai W, Chu D, Jian R, Hou P, He Y, Deng W.

DOI: 10.3390/polym18091122
Published: 2026-05-01
Container: Polymers (Basel)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/polym18091122,
  title = {Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions.},
  author = {Sun Y and  Wang H and  Jiang J and  Wang K and  Bai W and  Chu D and  Jian R and  Hou P and  He Y and  Deng W.},
  year = {2026},
  journal = {Polymers (Basel)},
  doi = {10.3390/polym18091122},
  url = {https://doi.org/10.3390/polym18091122}
}

RIS

TY  - JOUR
TI  - Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions.
AU  - Sun Y
AU  -  Wang H
AU  -  Jiang J
AU  -  Wang K
AU  -  Bai W
AU  -  Chu D
AU  -  Jian R
AU  -  Hou P
AU  -  He Y
AU  -  Deng W.
PY  - 2026
JO  - Polymers (Basel)
DO  - 10.3390/polym18091122
UR  - https://doi.org/10.3390/polym18091122
ER  -

APA

Y, S., H, W., J, J., K, W., W, B., D, C., R, J., P, H., Y, H., & W., D. (2026). Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions.. Polymers (Basel). https://doi.org/10.3390/polym18091122

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europe-pmc · retrieved 2026-09-27T02:38:09.067Z