Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant.

Chang J, Xu C, Dai Y

DOI: 10.3390/polym18131588
Published: 2026 Jun 26
Container: Polymers
Publisher: Not recorded
Open access: yes

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BibTeX

@article{allodium:10.3390/polym18131588,
  title = {Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant.},
  author = {Chang J and Xu C and Dai Y},
  year = {2026},
  journal = {Polymers},
  doi = {10.3390/polym18131588},
  url = {https://doi.org/10.3390/polym18131588}
}

RIS

TY  - JOUR
TI  - Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant.
AU  - Chang J
AU  - Xu C
AU  - Dai Y
PY  - 2026
JO  - Polymers
DO  - 10.3390/polym18131588
UR  - https://doi.org/10.3390/polym18131588
ER  -

APA

J, C., C, X., & Y, D. (2026). Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant.. Polymers. https://doi.org/10.3390/polym18131588

Source records

pubmed · retrieved 2026-09-25T06:14:14.462Z
europe-pmc · retrieved 2026-09-25T06:14:14.466Z