The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors.

Ok SH, Lee YH, Shim JH, Lim SK, Moon B

DOI: 10.3390/s17020426
Published: 2017 Feb 22
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s17020426,
  title = {The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors.},
  author = {Ok SH and Lee YH and Shim JH and Lim SK and Moon B},
  year = {2017},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s17020426},
  url = {https://doi.org/10.3390/s17020426}
}

RIS

TY  - JOUR
TI  - The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors.
AU  - Ok SH
AU  - Lee YH
AU  - Shim JH
AU  - Lim SK
AU  - Moon B
PY  - 2017
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s17020426
UR  - https://doi.org/10.3390/s17020426
ER  -

APA

SH, O., YH, L., JH, S., SK, L., & B, M. (2017). The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s17020426

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pubmed · retrieved 2026-09-26T02:08:52.704Z