Bond-Slip Monitoring of Concrete Structures Using Smart Sensors—A Review

Linsheng Huo, Hao Cheng, Qingzhao Kong, Xuemin Chen

Open source

DOI: 10.3390/s19051231
Published: 2019-03-11
Container: Sensors
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/s19051231,
  title = {Bond-Slip Monitoring of Concrete Structures Using Smart Sensors—A Review},
  author = {Linsheng Huo and Hao Cheng and Qingzhao Kong and Xuemin Chen},
  year = {2019},
  journal = {Sensors},
  doi = {10.3390/s19051231},
  url = {https://doi.org/10.3390/s19051231}
}

RIS

TY  - JOUR
TI  - Bond-Slip Monitoring of Concrete Structures Using Smart Sensors—A Review
AU  - Linsheng Huo
AU  - Hao Cheng
AU  - Qingzhao Kong
AU  - Xuemin Chen
PY  - 2019
JO  - Sensors
DO  - 10.3390/s19051231
UR  - https://doi.org/10.3390/s19051231
ER  -

APA

Huo, L., Cheng, H., Kong, Q., & Chen, X. (2019). Bond-Slip Monitoring of Concrete Structures Using Smart Sensors—A Review. Sensors. https://doi.org/10.3390/s19051231

Source records

crossref · retrieved 2026-09-25T08:01:56.034Z