Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems

Anna Persano, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano, Jacopo Iannacci

Open source

DOI: 10.3390/s20072133
Published: 2020-04-10
Container: Sensors
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/s20072133,
  title = {Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems},
  author = {Anna Persano and Fabio Quaranta and Antonietta Taurino and Pietro Aleardo Siciliano and Jacopo Iannacci},
  year = {2020},
  journal = {Sensors},
  doi = {10.3390/s20072133},
  url = {https://doi.org/10.3390/s20072133}
}

RIS

TY  - JOUR
TI  - Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems
AU  - Anna Persano
AU  - Fabio Quaranta
AU  - Antonietta Taurino
AU  - Pietro Aleardo Siciliano
AU  - Jacopo Iannacci
PY  - 2020
JO  - Sensors
DO  - 10.3390/s20072133
UR  - https://doi.org/10.3390/s20072133
ER  -

APA

Persano, A., Quaranta, F., Taurino, A., Siciliano, P. A., & Iannacci, J. (2020). Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems. Sensors. https://doi.org/10.3390/s20072133

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crossref · retrieved 2026-11-10T06:50:25.645Z