Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature.
- DOI
- 10.3390/s22072814
- Published
- 2022 Apr 6
- Container
- Sensors (Basel, Switzerland)
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/s22072814,
title = {Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature.},
author = {Wielandt S and Uhlemann S and Fiolleau S and Dafflon B},
year = {2022},
journal = {Sensors (Basel, Switzerland)},
doi = {10.3390/s22072814},
url = {https://doi.org/10.3390/s22072814}
}RIS
TY - JOUR TI - Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature. AU - Wielandt S AU - Uhlemann S AU - Fiolleau S AU - Dafflon B PY - 2022 JO - Sensors (Basel, Switzerland) DO - 10.3390/s22072814 UR - https://doi.org/10.3390/s22072814 ER -
APA
S, W., S, U., S, F., & B, D. (2022). Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s22072814
Source records
- pubmed · retrieved 2026-09-26T20:56:24.264Z