Sandwich Face Layer Debonding Detection and Size Estimation by Machine-Learning-Based Evaluation of Electromechanical Impedance Measurements.

Kralovec C, Lehner B, Kirchmayr M, Schagerl M

DOI: 10.3390/s23062910
Published: 2023 Mar 7
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s23062910,
  title = {Sandwich Face Layer Debonding Detection and Size Estimation by Machine-Learning-Based Evaluation of Electromechanical Impedance Measurements.},
  author = {Kralovec C and Lehner B and Kirchmayr M and Schagerl M},
  year = {2023},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s23062910},
  url = {https://doi.org/10.3390/s23062910}
}

RIS

TY  - JOUR
TI  - Sandwich Face Layer Debonding Detection and Size Estimation by Machine-Learning-Based Evaluation of Electromechanical Impedance Measurements.
AU  - Kralovec C
AU  - Lehner B
AU  - Kirchmayr M
AU  - Schagerl M
PY  - 2023
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s23062910
UR  - https://doi.org/10.3390/s23062910
ER  -

APA

C, K., B, L., M, K., & M, S. (2023). Sandwich Face Layer Debonding Detection and Size Estimation by Machine-Learning-Based Evaluation of Electromechanical Impedance Measurements.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s23062910

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pubmed · retrieved 2026-09-26T20:29:52.151Z