Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package.
- DOI
- 10.3390/s24165157
- Published
- 2024 Aug 9
- Container
- Sensors (Basel, Switzerland)
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/s24165157,
title = {Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package.},
author = {Wang D and Zhou W and Zhang Z and Meng F},
year = {2024},
journal = {Sensors (Basel, Switzerland)},
doi = {10.3390/s24165157},
url = {https://doi.org/10.3390/s24165157}
}RIS
TY - JOUR TI - Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package. AU - Wang D AU - Zhou W AU - Zhang Z AU - Meng F PY - 2024 JO - Sensors (Basel, Switzerland) DO - 10.3390/s24165157 UR - https://doi.org/10.3390/s24165157 ER -
APA
D, W., W, Z., Z, Z., & F, M. (2024). Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s24165157