MEMS Pressure Sensors with Novel TSV Design for Extreme Temperature Environments.
- DOI
- 10.3390/s25030636
- Published
- 2025 Jan 22
- Container
- Sensors (Basel, Switzerland)
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3390/s25030636,
title = {MEMS Pressure Sensors with Novel TSV Design for Extreme Temperature Environments.},
author = {Ghanam M and Woias P and Goldschmidtböing F},
year = {2025},
journal = {Sensors (Basel, Switzerland)},
doi = {10.3390/s25030636},
url = {https://doi.org/10.3390/s25030636}
}RIS
TY - JOUR TI - MEMS Pressure Sensors with Novel TSV Design for Extreme Temperature Environments. AU - Ghanam M AU - Woias P AU - Goldschmidtböing F PY - 2025 JO - Sensors (Basel, Switzerland) DO - 10.3390/s25030636 UR - https://doi.org/10.3390/s25030636 ER -
APA
M, G., P, W., & F, G. (2025). MEMS Pressure Sensors with Novel TSV Design for Extreme Temperature Environments.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s25030636