PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure.

Xu Y, Wu H, Liu Y, Zhang X

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DOI: 10.3390/s25113550
Published: 2025 Jun 4
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s25113550,
  title = {PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure.},
  author = {Xu Y and Wu H and Liu Y and Zhang X},
  year = {2025},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s25113550},
  url = {https://doi.org/10.3390/s25113550}
}

RIS

TY  - JOUR
TI  - PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure.
AU  - Xu Y
AU  - Wu H
AU  - Liu Y
AU  - Zhang X
PY  - 2025
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s25113550
UR  - https://doi.org/10.3390/s25113550
ER  -

APA

Y, X., H, W., Y, L., & X, Z. (2025). PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s25113550

Source records

pubmed · retrieved 2026-09-26T01:13:24.206Z
europe-pmc · retrieved 2026-09-26T01:13:24.214Z
doaj · retrieved 2026-09-26T01:13:24.236Z