Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.

Meshki Zadeh P, Brand S, Dehghan-Niri E

DOI: 10.3390/s25247499
Published: 2025 Dec 10
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s25247499,
  title = {Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.},
  author = {Meshki Zadeh P and Brand S and Dehghan-Niri E},
  year = {2025},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s25247499},
  url = {https://doi.org/10.3390/s25247499}
}

RIS

TY  - JOUR
TI  - Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.
AU  - Meshki Zadeh P
AU  - Brand S
AU  - Dehghan-Niri E
PY  - 2025
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s25247499
UR  - https://doi.org/10.3390/s25247499
ER  -

APA

P, M. Z., S, B., & E, D. (2025). Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s25247499

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pubmed · retrieved 2026-09-25T06:56:55.331Z