Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.

Zhang S, Chen L, Fu J, Yang C, Chen G

DOI: 10.3390/s26082292
Published: 2026 Apr 8
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s26082292,
  title = {Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.},
  author = {Zhang S and Chen L and Fu J and Yang C and Chen G},
  year = {2026},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s26082292},
  url = {https://doi.org/10.3390/s26082292}
}

RIS

TY  - JOUR
TI  - Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.
AU  - Zhang S
AU  - Chen L
AU  - Fu J
AU  - Yang C
AU  - Chen G
PY  - 2026
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s26082292
UR  - https://doi.org/10.3390/s26082292
ER  -

APA

S, Z., L, C., J, F., C, Y., & G, C. (2026). Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s26082292

Source records

pubmed · retrieved 2026-09-25T05:13:41.212Z