Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints.

Mauersberger VW, Senf B, Menzel S

DOI: 10.3390/s26123738
Published: 2026 Jun 11
Container: Sensors (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/s26123738,
  title = {Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints.},
  author = {Mauersberger VW and Senf B and Menzel S},
  year = {2026},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s26123738},
  url = {https://doi.org/10.3390/s26123738}
}

RIS

TY  - JOUR
TI  - Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints.
AU  - Mauersberger VW
AU  - Senf B
AU  - Menzel S
PY  - 2026
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s26123738
UR  - https://doi.org/10.3390/s26123738
ER  -

APA

VW, M., B, S., & S, M. (2026). Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s26123738

Source records

pubmed · retrieved 2026-09-26T19:50:03.345Z