FBG-Based Multi-Parameter Sensor for Harsh Transformer Conditions: Decoupling Packaging for Simultaneous Temperature, Pressure, and Moisture Measurement

Debao Wang, Shangang Ma, Fubao Jin, Ruiming Wang

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DOI: 10.3390/s26134243
Published: 2026-07-04
Container: Sensors
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/s26134243,
  title = {FBG-Based Multi-Parameter Sensor for Harsh Transformer Conditions: Decoupling Packaging for Simultaneous Temperature, Pressure, and Moisture Measurement},
  author = {Debao Wang and Shangang Ma and Fubao Jin and Ruiming Wang},
  year = {2026},
  journal = {Sensors},
  doi = {10.3390/s26134243},
  url = {https://doi.org/10.3390/s26134243}
}

RIS

TY  - JOUR
TI  - FBG-Based Multi-Parameter Sensor for Harsh Transformer Conditions: Decoupling Packaging for Simultaneous Temperature, Pressure, and Moisture Measurement
AU  - Debao Wang
AU  - Shangang Ma
AU  - Fubao Jin
AU  - Ruiming Wang
PY  - 2026
JO  - Sensors
DO  - 10.3390/s26134243
UR  - https://doi.org/10.3390/s26134243
ER  -

APA

Wang, D., Ma, S., Jin, F., & Wang, R. (2026). FBG-Based Multi-Parameter Sensor for Harsh Transformer Conditions: Decoupling Packaging for Simultaneous Temperature, Pressure, and Moisture Measurement. Sensors. https://doi.org/10.3390/s26134243

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crossref · retrieved 2026-09-25T10:33:55.416Z