Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments
- DOI
- 10.3390/s26175525
- Published
- 2026-08-31
- Container
- Sensors
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/s26175525,
title = {Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments},
author = {Zan Liu and Weijun Tong and Feng Wang and Qianfeng He and Shuhui Liu and Quanrong Deng and Wei Huang and Haoze Du},
year = {2026},
journal = {Sensors},
doi = {10.3390/s26175525},
url = {https://doi.org/10.3390/s26175525}
}RIS
TY - JOUR TI - Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments AU - Zan Liu AU - Weijun Tong AU - Feng Wang AU - Qianfeng He AU - Shuhui Liu AU - Quanrong Deng AU - Wei Huang AU - Haoze Du PY - 2026 JO - Sensors DO - 10.3390/s26175525 UR - https://doi.org/10.3390/s26175525 ER -
APA
Liu, Z., Tong, W., Wang, F., He, Q., Liu, S., Deng, Q., Huang, W., & Du, H. (2026). Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments. Sensors. https://doi.org/10.3390/s26175525
Source records
- crossref · retrieved 2026-09-26T10:02:43.767Z