A High-Throughput Memory Compression Architecture for Real-Time 3D Visual Tracking and Quantification on Edge Devices.

Cheng Y, Guo L, Zhou R, Zhou Q, Li LH, Ivanović M, Li KC, Ye G

Open source

DOI
10.3390/s26175656
Published
2026 Sep 5
Container
Sensors (Basel, Switzerland)
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.3390/s26175656,
  title = {A High-Throughput Memory Compression Architecture for Real-Time 3D Visual Tracking and Quantification on Edge Devices.},
  author = {Cheng Y and Guo L and Zhou R and Zhou Q and Li LH and Ivanović M and Li KC and Ye G},
  year = {2026},
  journal = {Sensors (Basel, Switzerland)},
  doi = {10.3390/s26175656},
  url = {https://doi.org/10.3390/s26175656}
}

RIS

TY  - JOUR
TI  - A High-Throughput Memory Compression Architecture for Real-Time 3D Visual Tracking and Quantification on Edge Devices.
AU  - Cheng Y
AU  - Guo L
AU  - Zhou R
AU  - Zhou Q
AU  - Li LH
AU  - Ivanović M
AU  - Li KC
AU  - Ye G
PY  - 2026
JO  - Sensors (Basel, Switzerland)
DO  - 10.3390/s26175656
UR  - https://doi.org/10.3390/s26175656
ER  - 

APA

Y, C., L, G., R, Z., Q, Z., LH, L., M, I., KC, L., & G, Y. (2026). A High-Throughput Memory Compression Architecture for Real-Time 3D Visual Tracking and Quantification on Edge Devices.. Sensors (Basel, Switzerland). https://doi.org/10.3390/s26175656

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