Evaluation of an IoT Strain-Sensing System with LoRa Telemetry and Asset Metadata

Xiaoxiao Bu, Shenshi Jiang, Henry Gong, Tommy Chaung, Enbang Li, Zhengyi Jiang

Open source

DOI: 10.3390/s26185686
Published: 2026-09-08
Container: Sensors
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/s26185686,
  title = {Evaluation of an IoT Strain-Sensing System with LoRa Telemetry and Asset Metadata},
  author = {Xiaoxiao Bu and Shenshi Jiang and Henry Gong and Tommy Chaung and Enbang Li and Zhengyi Jiang},
  year = {2026},
  journal = {Sensors},
  doi = {10.3390/s26185686},
  url = {https://doi.org/10.3390/s26185686}
}

RIS

TY  - JOUR
TI  - Evaluation of an IoT Strain-Sensing System with LoRa Telemetry and Asset Metadata
AU  - Xiaoxiao Bu
AU  - Shenshi Jiang
AU  - Henry Gong
AU  - Tommy Chaung
AU  - Enbang Li
AU  - Zhengyi Jiang
PY  - 2026
JO  - Sensors
DO  - 10.3390/s26185686
UR  - https://doi.org/10.3390/s26185686
ER  -

APA

Bu, X., Jiang, S., Gong, H., Chaung, T., Li, E., & Jiang, Z. (2026). Evaluation of an IoT Strain-Sensing System with LoRa Telemetry and Asset Metadata. Sensors. https://doi.org/10.3390/s26185686

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crossref · retrieved 2026-11-10T18:23:59.381Z