First-principles study on elastic properties of Cu, (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn and interfacial mechanical properties of (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn/Cu in the lead-free solder joint.
- DOI
- 10.3762/bjnano.17.29
- Published
- 2026-03-19
- Container
- Beilstein J Nanotechnol
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.3762/bjnano.17.29,
title = {First-principles study on elastic properties of Cu, (Cu\<sub\>1-\</sub\> \<i\>\<sub\>x\</sub\>\</i\> ,Ni \<i\>\<sub\>x\</sub\>\</i\> )\<sub\>3\</sub\>Sn and interfacial mechanical properties of (Cu\<sub\>1-\</sub\> \<i\>\<sub\>x\</sub\>\</i\> ,Ni \<i\>\<sub\>x\</sub\>\</i\> )\<sub\>3\</sub\>Sn/Cu in the lead-free solder joint.},
author = {Hua G.},
year = {2026},
journal = {Beilstein J Nanotechnol},
doi = {10.3762/bjnano.17.29},
url = {https://doi.org/10.3762/bjnano.17.29}
}RIS
TY - JOUR TI - First-principles study on elastic properties of Cu, (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn and interfacial mechanical properties of (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn/Cu in the lead-free solder joint. AU - Hua G. PY - 2026 JO - Beilstein J Nanotechnol DO - 10.3762/bjnano.17.29 UR - https://doi.org/10.3762/bjnano.17.29 ER -
APA
G., H. (2026). First-principles study on elastic properties of Cu, (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn and interfacial mechanical properties of (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn/Cu in the lead-free solder joint.. Beilstein J Nanotechnol. https://doi.org/10.3762/bjnano.17.29
Source records
- europe-pmc · retrieved 2026-09-26T15:37:04.194Z
- doaj · retrieved 2026-09-26T15:37:04.195Z