Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit Boards
- DOI
- 10.4071/001c.74620
- Published
- 2023-05-01
- Container
- IMAPSource Proceedings
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.4071/001c.74620,
title = {Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit Boards},
author = {Emily Lamport and Andrew Luce and Yuri Piro and Susan Trulli and Alkim Akyurtlu},
year = {2023},
journal = {IMAPSource Proceedings},
doi = {10.4071/001c.74620},
url = {https://doi.org/10.4071/001c.74620}
}RIS
TY - JOUR TI - Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit Boards AU - Emily Lamport AU - Andrew Luce AU - Yuri Piro AU - Susan Trulli AU - Alkim Akyurtlu PY - 2023 JO - IMAPSource Proceedings DO - 10.4071/001c.74620 UR - https://doi.org/10.4071/001c.74620 ER -
APA
Lamport, E., Luce, A., Piro, Y., Trulli, S., & Akyurtlu, A. (2023). Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit Boards. IMAPSource Proceedings. https://doi.org/10.4071/001c.74620
Source records
- crossref · retrieved 2026-09-25T12:02:00.506Z