The Grinding Influence On The Strength Of Fan-Out Wafer-Level Packages
- DOI
- 10.5281/zenodo.1316230
- Published
- 2018
- Container
- Not recorded
- Publisher
- Zenodo
- Open access
- yes
Credibility signals
limited evidence Score 47/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- cautionDOI registered: No matching Crossref record was present in this response.
- cautionDOI resolves: No matching Crossref record was present in this response.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- supportingOpen access status: Normalized open-access status: open.
- supportingPublication license: A publication license was supplied: https://creativecommons.org/licenses/by/4.0. Presence improves reuse transparency, not research validity.
- not scoredPublication version: A publication version was supplied but is not scored.
- cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty.
Cite this work
BibTeX
@article{allodium:10.5281/zenodo.1316230,
title = {The Grinding Influence On The Strength Of Fan-Out Wafer-Level Packages},
author = {Z. W. Zhong and C. Xu and W. K. Choi},
year = {2018},
doi = {10.5281/zenodo.1316230},
url = {https://doi.org/10.5281/zenodo.1316230}
}RIS
TY - JOUR TI - The Grinding Influence On The Strength Of Fan-Out Wafer-Level Packages AU - Z. W. Zhong AU - C. Xu AU - W. K. Choi PY - 2018 DO - 10.5281/zenodo.1316230 UR - https://doi.org/10.5281/zenodo.1316230 ER -
APA
Zhong, Z. W., Xu, C., & Choi, W. K. (2018). The Grinding Influence On The Strength Of Fan-Out Wafer-Level Packages. https://doi.org/10.5281/zenodo.1316230