Mortise and Tenon Full Stack 1_ An Innovative Concept of Multi-Chip Integration Based on Mechanical Properties of Mortise and Tenon in the Post-Moore Era - Framework Construction and Adaptation Optimization
- DOI
- 10.5281/zenodo.18338091
- Published
- 2025
- Container
- Not recorded
- Publisher
- Zenodo
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.5281/zenodo.18338091,
title = {Mortise and Tenon Full Stack 1\_ An Innovative Concept of Multi-Chip Integration Based on Mechanical Properties of Mortise and Tenon in the Post-Moore Era - Framework Construction and Adaptation Optimization},
author = {Zhou, Relike},
year = {2025},
doi = {10.5281/zenodo.18338091},
url = {https://doi.org/10.5281/zenodo.18338091}
}RIS
TY - JOUR TI - Mortise and Tenon Full Stack 1_ An Innovative Concept of Multi-Chip Integration Based on Mechanical Properties of Mortise and Tenon in the Post-Moore Era - Framework Construction and Adaptation Optimization AU - Zhou, Relike PY - 2025 DO - 10.5281/zenodo.18338091 UR - https://doi.org/10.5281/zenodo.18338091 ER -
APA
Relike, Z. (2025). Mortise and Tenon Full Stack 1_ An Innovative Concept of Multi-Chip Integration Based on Mechanical Properties of Mortise and Tenon in the Post-Moore Era - Framework Construction and Adaptation Optimization. https://doi.org/10.5281/zenodo.18338091
Source records
- datacite · retrieved 2026-09-27T15:27:48.063Z