Inline Mapping of Amorphous Silicon Layer Thickness of Heterojunction Precursors Using Multispectral Imaging

Saravana Kumar, Christian Diestel, Saed Al-Hajjawi, Jurriaan Schmitz, Marc Hemsendorf, Jonas Haunschild, Stefan J. Rupitsch, Stefan Rein

Open source

DOI: 10.52825/siliconpv.v2i.1324
Published: 2025-01-03
Container: SiliconPV Conference Proceedings
Publisher: TIB Open Publishing
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.52825/siliconpv.v2i.1324,
  title = {Inline Mapping of Amorphous Silicon Layer Thickness of Heterojunction Precursors Using Multispectral Imaging},
  author = {Saravana Kumar and Christian Diestel and Saed Al-Hajjawi and Jurriaan Schmitz and Marc Hemsendorf and Jonas Haunschild and Stefan J. Rupitsch and Stefan Rein},
  year = {2025},
  journal = {SiliconPV Conference Proceedings},
  doi = {10.52825/siliconpv.v2i.1324},
  url = {https://doi.org/10.52825/siliconpv.v2i.1324}
}

RIS

TY  - JOUR
TI  - Inline Mapping of Amorphous Silicon Layer Thickness of Heterojunction Precursors Using Multispectral Imaging
AU  - Saravana Kumar
AU  - Christian Diestel
AU  - Saed Al-Hajjawi
AU  - Jurriaan Schmitz
AU  - Marc Hemsendorf
AU  - Jonas Haunschild
AU  - Stefan J. Rupitsch
AU  - Stefan Rein
PY  - 2025
JO  - SiliconPV Conference Proceedings
DO  - 10.52825/siliconpv.v2i.1324
UR  - https://doi.org/10.52825/siliconpv.v2i.1324
ER  -

APA

Kumar, S., Diestel, C., Al-Hajjawi, S., Schmitz, J., Hemsendorf, M., Haunschild, J., Rupitsch, S. J., & Rein, S. (2025). Inline Mapping of Amorphous Silicon Layer Thickness of Heterojunction Precursors Using Multispectral Imaging. SiliconPV Conference Proceedings. https://doi.org/10.52825/siliconpv.v2i.1324

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crossref · retrieved 2026-09-25T21:53:38.883Z