<strong>Atomistic Understanding of Hybrid Bonding in Cu Interfaces Using Multiscale Microscopy</strong>
- DOI
- 10.60893/figshare.apl.c.8794548.v1
- Published
- 2026
- Container
- Not recorded
- Publisher
- AIP Publishing
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.60893/figshare.apl.c.8794548.v1,
title = {<strong>Atomistic Understanding of Hybrid Bonding in Cu Interfaces Using Multiscale Microscopy</strong>},
author = {Karthick Gothandapani and Nicholas Polomoff and Baishakhi Mazumder and Ihit Shukla},
year = {2026},
doi = {10.60893/figshare.apl.c.8794548.v1},
url = {https://doi.org/10.60893/figshare.apl.c.8794548.v1}
}RIS
TY - JOUR TI - <strong>Atomistic Understanding of Hybrid Bonding in Cu Interfaces Using Multiscale Microscopy</strong> AU - Karthick Gothandapani AU - Nicholas Polomoff AU - Baishakhi Mazumder AU - Ihit Shukla PY - 2026 DO - 10.60893/figshare.apl.c.8794548.v1 UR - https://doi.org/10.60893/figshare.apl.c.8794548.v1 ER -
APA
Gothandapani, K., Polomoff, N., Mazumder, B., & Shukla, I. (2026). <strong>Atomistic Understanding of Hybrid Bonding in Cu Interfaces Using Multiscale Microscopy</strong>. https://doi.org/10.60893/figshare.apl.c.8794548.v1
Source records
- datacite · retrieved 2026-11-10T09:53:24.686Z