Power modules design and optimization for medium power of MMC inverters : high insulation voltage gate driver system and 3D packaging

Sokchea Am

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DOI
10.70675/42af2a60zf444z49bdza768z8e466313f5fa
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Not recorded
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Agence Bibliographique de l'Enseignement Supérieur
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BibTeX

@article{allodium:10.70675/42af2a60zf444z49bdza768z8e466313f5fa,
  title = {Power modules design and optimization for medium power of MMC inverters : high insulation voltage gate driver system and 3D packaging},
  author = {Sokchea Am},
  doi = {10.70675/42af2a60zf444z49bdza768z8e466313f5fa},
  url = {https://doi.org/10.70675/42af2a60zf444z49bdza768z8e466313f5fa}
}

RIS

TY  - JOUR
TI  - Power modules design and optimization for medium power of MMC inverters : high insulation voltage gate driver system and 3D packaging
AU  - Sokchea Am
DO  - 10.70675/42af2a60zf444z49bdza768z8e466313f5fa
UR  - https://doi.org/10.70675/42af2a60zf444z49bdza768z8e466313f5fa
ER  - 

APA

Am, S. (n.d.). Power modules design and optimization for medium power of MMC inverters : high insulation voltage gate driver system and 3D packaging. https://doi.org/10.70675/42af2a60zf444z49bdza768z8e466313f5fa

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