Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration

Romain Galand

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DOI: 10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0
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Publisher: Agence Bibliographique de l'Enseignement Supérieur
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Cite this work

BibTeX

@article{allodium:10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0,
  title = {Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration},
  author = {Romain Galand},
  doi = {10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0},
  url = {https://doi.org/10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0}
}

RIS

TY  - JOUR
TI  - Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration
AU  - Romain Galand
DO  - 10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0
UR  - https://doi.org/10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0
ER  -

APA

Galand, R. (n.d.). Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration. https://doi.org/10.70675/95b91b1fz87f2z4bf2z9953zad688b399ef0

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crossref · retrieved 2026-11-10T17:59:04.111Z