Fully Integrated Electrochemical Sensor Based on Surface Activated Copper/Polymer Bonding for Lead Detection

Redhwan, Md Taufique Zaman

DOI: 10.71548/13260
Published: 2018
Container: Not recorded
Publisher: McMaster University
Open access: no

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Cite this work

BibTeX

@article{allodium:10.71548/13260,
  title = {Fully Integrated Electrochemical Sensor Based on Surface Activated Copper/Polymer Bonding for Lead Detection},
  author = {Redhwan, Md Taufique Zaman},
  year = {2018},
  doi = {10.71548/13260},
  url = {https://doi.org/10.71548/13260}
}

RIS

TY  - JOUR
TI  - Fully Integrated Electrochemical Sensor Based on Surface Activated Copper/Polymer Bonding for Lead Detection
AU  - Redhwan, Md Taufique Zaman
PY  - 2018
DO  - 10.71548/13260
UR  - https://doi.org/10.71548/13260
ER  -

APA

Zaman, R. M. T. (2018). Fully Integrated Electrochemical Sensor Based on Surface Activated Copper/Polymer Bonding for Lead Detection. https://doi.org/10.71548/13260

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datacite · retrieved 2026-09-25T04:07:31.059Z