The Reliability Analysis of a Micro-punching Mold for IC Packing Bag
- Type
- Retraction
- Notice date
- 6/17/2010 0:00
- Journal
- 2010 2nd International Conference on Computer Engineering and Technology
- Publisher
- IEEE: Institute of Electrical and Electronics Engineers
- Notice DOI
- 10.1109/iccet.2010.5485740
- Original paper DOI
- Not recorded