Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly
- Type
- Retraction
- Notice date
- 9/3/2018 0:00
- Journal
- Journal of Failure Analysis and Prevention
- Publisher
- Springer
- Notice DOI
- 10.1007/s11668-018-0532-3
- Original paper DOI
- 10.1007/s11668-017-0296-1