TSV Aware 3D IC Partitioning with Area Optimization
- Type
- Retraction
- Notice date
- 10/20/2022 0:00
- Journal
- Arabian Journal for Science and Engineering
- Publisher
- Springer
- Notice DOI
- 10.1007/s13369-021-05604-9
- Original paper DOI
- 10.1007/s13369-021-05604-9
Reasons
- Compromised Peer Review
- Investigation by Journal/Publisher
- Rogue Editor
- Unreliable Results and/or Conclusions