High-bandwidth IC interconnects with silicon interposers and bridges for 3D multi-chip integration and packaging

Type: Retraction
Notice date: 5/8/2017 0:00
Journal: 2017 China Semiconductor Technology International Conference (CSTIC)
Publisher: IEEE: Institute of Electrical and Electronics Engineers
Notice DOI: 10.1109/cstic.2017.7919874
Original paper DOI: 10.1109/cstic.2017.7919874

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