Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints

Type: Retraction
Notice date: 10/4/2018 0:00
Journal: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Publisher: IEEE: Institute of Electrical and Electronics Engineers
Notice DOI: 10.1109/icept.2018.8480771
Original paper DOI: 10.1109/icept.2018.8480771

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