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In-situ study the effect of IMC thickness on tensile behavior of the Cu/Sn0.7Cu/Ni interconnects
- Type
- Retraction
- Notice date
- 4/30/2020 0:00
- Journal
- 2019 20th International Conference on Electronic Packaging Technology (ICEPT)
- Publisher
- IEEE: Institute of Electrical and Electronics Engineers
- Notice DOI
- 10.1109/icept47577.2019.246033
- Original paper DOI
- 10.1109/icept47577.2019.246033
Reasons