Features of contact melting of semiconductors and their microstructures under thermal shock conditions
- Type
- Retraction
- Notice date
- 10/30/2023 0:00
- Journal
- Applied Physics A
- Publisher
- Springer
- Notice DOI
- 10.1007/s00339-023-07085-z
- Original paper DOI
- 10.1007/s00339-022-05398-z
Reasons
- Complaints about Third Party
- Concerns/Issues about Authorship/Affiliation
- Concerns/Issues about Peer Review
- Euphemisms for Plagiarism
- Investigation by Journal/Publisher
- Objections by Author(s)
- Plagiarism of/in Article
- Unreliable Results and/or Conclusions