Retraction notices

Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach

Type

Retraction

Notice date

4/11/2025 0:00

Journal

Journal of Electronic Materials

Publisher

Springer - Nature Publishing Group

Notice DOI

10.1007/s11664-025-11938-z

Original paper DOI

10.1007/s11664-022-09635-2

Reasons

• Concerns/Issues about Authorship/Affiliation
• Concerns/Issues about Peer Review
• Investigation by Journal/Publisher
• Unreliable Results and/or Conclusions

Matching venue names

Name match only, not an authoritative journal identifier.

• Journal of Electronic Materials