Retraction notices

Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications

Type

Retraction

Notice date

2/28/2017 0:00

Journal

Transactions of The Japan Institute of Electronics Packaging

Publisher

The Japan Institute of Electronics Packaging

Notice DOI

10.5104/jiepeng.9.retr01_1

Original paper DOI

10.5104/jiepeng.9.e16-007-1

Reasons

• Copyright Claims
• Notice - Limited or No Information

Matching venue names

Name match only, not an authoritative journal identifier.

• Transactions of The Japan Institute of Electronics Packaging