High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages
- Type
- Retraction
- Notice date
- 4/5/2023 0:00
- Journal
- Microsystem Technologies
- Publisher
- Springer
- Notice DOI
- 10.1007/s00542-023-05445-6
- Original paper DOI
- 10.1007/s00542-019-04435-x