Low temperature soldering technology based on superhydrophobic copper microlayer
- Type
- Retraction
- Notice date
- 12/9/2025 0:00
- Journal
- Heliyon
- Publisher
- Elsevier - Cell Press
- Notice DOI
- 10.1016/j.heliyon.2025.e44325
- Original paper DOI
- 10.1016/j.heliyon.2024.e28393
Reasons
- Duplication of/in Image
- Euphemisms for Duplication
- Investigation by Journal/Publisher
- Unreliable Results and/or Conclusions